NSP1833 series MEMS differential pressure sensor wafer is mainly made via the piezoresistive effect of silicon with NOVOSENSE independent R&D MEMS micro machining process design. The sensor wafer manufacturing platform is qualified by IATF16949, and the front/back side of every wafer pass AOI tested which compiles with AEC-Q103 standards. This series of MEMS wafers can realize differential pressure detection, which can be widely used in automotive electronics, medical electronics, white household appliances and industrial control fields.
• Operating temperature range: -40℃~85℃
• Pressure range: 0kPa~±1kPa
• The accuracy and stability in the life cycle are better than 1%F.S.
• Automotive-qualified IATF16949-certified process platform
• Comply with RoHS & REACH and halogen-free requirements
• Compiles with AEC-Q103 standard
• Single chip size: 2.5mmx2.5mmx0.4mm
• Industrial: fire residual pressure monitoring, HVAC/VAV, pressure transmitter, pressure switch, negative pressure vacuum detection, gas flow monitoring
• Medical: ventilator, sphygmomanometer, oxygen generator, anesthesia apparatus, biosesafety cabinet
